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            400-885-9898
            更新于 4月9日
            智聯APPAPP
            舉報
            壓合工程師
            1-1.6萬·13薪
            • 重慶江北區
            • 3-5年
            • 本科
            • 全職
            • 招1人
            職位描述
            壓合
            Your Responsibilities
             1.Responsible for Relam process initial preparation and qualification on new project technologies, equipments, materials and processes for mass production purpose.
             2.Define relevant processes, equipment or tools specifications & project timeline for new projects. (including purchase request preparation)
             3.Execution of feasibility studies on new engineering concepts and hypothesis.
             4.Definition and implementation of measurement rule or guideline to secure and achieve customer requirements or yield target.
             5.Liaise with external suppliers (equipment, material or chemical suppliers) and relevant departments for technological development and advancement.
             6.Generates written documentation of procedures, additional study, design guideline & standard specification. (including training to related deparment)
             7.Ensure new process stability and robustness which compliance with full processes to achieve high quality and reliable products.
             8.Involvement in Intelligence disclosure idea sharing or submission.
             9.Continuous justification or fulfillment on cost saving, resources optimization & EHS requirements.
             10.Willingness to support assignment task beyond working hour.
             11.Proactive in approaching superior or related reporting line for guidance and outcome alignment.
             12.Provide technical know-how guidance & documentation preparation guideline to team members.
             

             Your Profile
             1.Minimum education level from Bachelor Degree in engineering basis.
             2.Knowledge of project management, data analysis and design of experiments.
             3.Knowledge of data analysis tools (such as SPC, MSA, DOE, FMEA, CP, etc)
             4.Minimum 6 years of Engineering experience in IC-Substrate, HDI/mSAP-PCB, Assembly, IC-Packaging or related industry especially in Relam process.
             5.Minimum 4 years Working experience with multinational or intercultural teams.
             6.Good analytical skills with attention to details. 
             7.Good stress management skills
             8.Fluent written and oral English (Mandarin would be of advantage)
             9.Open minded approach and willing to overcome new challenges.
             10.Good team working spirit 
             11.Good communication and negotiation skills 
             12.Computer skills – MS Office Package (Word, Excel, Powerpoint etc)
             13.Willingness to travel and stay abroad for certain period of time.
             14.Take lead and coordinate for cross department deal on new projects or given tasks.
             15.Good presentation skills for any meeting occasion.
             

             Once a resume is submitted to the recruiting company, it is considered that the applicant agrees to the collection, processing, use, and disclosure of their resume and other personal information by the recruiting company for recruitment purposes. 
一旦向招聘公司投遞簡歷，即視為應聘者同意招聘公司基于招聘目的而對其簡歷和其他個人信息進行收集、處理、使用和披露等。
            工作地點
            奧特斯科技(重慶)有限公司重慶江北區魚嘴鎮長和路58號
             
             
            職位發布者
            黃女士/HR
            當前在線
            立即溝通 
            公司Logo奧特斯科技(重慶)有限公司
            奧特斯是全球領先的高品質半導體封裝載板和印制電路板制造商，企業致力于生產和開發具有前瞻性的聯接技術，核心領域涵蓋移動設備、汽車和航天、工業電子、醫療與健康以及高性能虛擬現實和人工智能芯片應用領域。作為一家飛速發展的跨國公司，奧特斯全球擁有13,500多名員工，分別在奧地利（萊奧本、菲嶺）、印度（南燕古德）、中國（上海、重慶）和馬來西亞（居林）擁有生產基地。奧特斯扎根中國發展逾20年，分別在上海（2001年）和重慶（2011年）建立生產基地。奧特斯（中國）有限公司成立于2001年，主要生產高密度互連印制電路板（HDI）和半導體封裝載板（IC substrates），客戶涵蓋業界頂尖的消費電子制造商、智能手機制造商、半導體制造商和汽車電子制造商。公司地址：上海市閔行區莘莊工業區金都路5000號。奧特斯科技（重慶）有限公司建立于2011年，是奧特斯集團在中國設立的第二家獨資企業，現有員工約5000人。奧特斯目前在中國重慶工廠投資兩大尖端技術，生產全球領先的半導體封裝載板和模組產品，產品應用于電腦微處理器、移動設備、可穿戴設備和高端物聯網產品。作為一家高新技術企業，奧特斯重慶率先將全球最先進半導體封裝載板生產技術引入中國，是中國首家高端半導體封裝載板制造商。公司地址：重慶市江北區魚嘴鎮長和路58號。奧特斯通過將核心業務與新技術相結合，擴展其在價值鏈中的地位，迎接市場機遇，推動企業的可持續性發展。奧特斯的解決方案推動著5G、物聯網、自動駕駛以及人工智能等未來技術的創新。奧特斯將保持可持續、盈利性增長，鞏固其在半導體封裝載板領域的市場地位，實現“先進解決方案的首選”這一宏偉愿景目標。(特別說明：我司所有招聘工作按照RBA用工要求，充分尊重人權，人員招聘無宗教信仰/性別等歧視，不招聘童工。對未成年工不安排接觸職業危害的崗位，不安排倒班。)
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